The Dieline Summit

The next Emballage (Paris, 17-20th November 2014) will feature the first French edition of  “The Dieline Summit - The Peak of Package Design”.

The encounter, the result of collaboration between the well-known U.S. website The Dieline.com, owned by Andrew Gibbs, and the organizers of the French Salon (Comexposium), will begin November 16th, with an evening of networking and continue 17th with a program of ongoing conferences and workshops.

Full satisfaction was expressed by Véronique Sestrières, director of the Paris show. The Dieline.com is an important packaging design landmark, along with the eponymous conference which takes place every year in the U.S. and the Dieline Awards. “The Salon” thus enhances its mission as international sector event, organizing an encounter that aims «at rethinking, together with the leaders of the industry, the future of packaging design by focusing on innovation».

For its part, Gibbs further expands his own horizons, ideally continuing a process that he began as a blogger, collector of images and projects, and that  led to the creation of a platform where professionals and enthusiasts around the world follow and comment on products and trends.