mverrini

Focus on the entire production cycle of a cosmetic product, from the raw materials to process and packaging technologies and to contracts, all with the complement of innovation: Cosmopack 2024 confirms its unique character in the international trade fair panorama of events dedicated to beauty, offering a sure attraction for professionals from all over the world. Antonia Benvegnù talks to us about the event, anticipating some new significant developments that make the BolognaFiere Cosmoprof show “always unique and different”.

With the Technomelt E-COM portfolio for e-commerce packaging, Henkel Adhesive Technologies offers hot melt adhesive solutions for right-sized cartons and envelopes.

The new Regulation (EU) 2023/1230 published in the Official Journal of the European Union on 29 June will entirely replace the existing Directive 2006/42/EC (“Machinery Directive”) as of 20 January 2027. This means that technology manufacturers have three years to adapt to the new requirements outlined below.

Green Tag RFID and corrugated cardboard packaging: a winning combination for all companies that wish to achieve the three e’s: efficiency, economy and ecology.

A big success for the second edition of Milan Beauty Week 2023 (26 September - 2 October)

The sector will close the year with revenues of €9.05 billion, 6% up on the all-time record of 2022. Orders are also at record levels, with 8 months of guaranteed production in 2024

This is the leitmotif characterising Anuga 2023 by Koelnmesse (Cologne, 7-11 October)

The 2023 edition of Cibus Tec successfully confirmed Parma as the capital of technological innovation for the food and beverage industry.

Servotecnica presents a new smart and connected component.

Introduced by Robatech in 2021, the Vision adhesive melter stands for high-quality adhesive application. Smart and sustainable, its modern design convinced customers from the start. In the meantime, more functions and options have been added, so that today, the Vision adhesive melter is even more attractive.