New adhesives application standards

The future of adhesives application is already here, and Robatech brings it to Emballage.

Concept MOD is an adhesive melting system with no tank shown for the first time in Paris. Robatech has integrated innovative melt on demand (MOD) technology with its established Concept series, putting into practice the concept of melt on demand, by which the amount of adhesive required for gluing undergoes no unnecessary thermal stress. This technology enables significantly accelerating heating times compared to conventional processes, carrying both lower consumption costs and reduced risk of blockage of the nozzle and filter caused by scorching.  All this translates into greater production line efficiency, as well as greater sustainability and operator safety.

The show goes on. At Emballage, Robatech also presents GranulateContainer for efficient and contamination-free feeding of thermoplastic adhesive in granulates. This container safeguards the adhesives against environmental contaminants that might cause the material to deteriorate or the granulates to stick together, thus enhancing the efficiency of the entire system. The special shape of GranulateContainer’s interior enables continuous granulate suction feed with no hiccups.
Also on show are the Diamond series hotmelt applicator guns. The new robust AX Diamond series (as well as the SX Diamond and SpeedStar Diamond series) is equipped with CoolTouch insulation: invented by Robatech, this solution enhances safety in case of contact and protects the product. The insulation also enables saving on energy costs and guarantees low environmental impact.

Unveiled at Paris’s Emballage (pav 3, stand 22a), Robatech’s new state-of-the-art Concept MOD (melt on demand).