Gefran technology for the packaging world
Sensors, digitalisation, data management, predictive maintenance, Digital Twin and A.I.
Exploiting the know-how developed in over 60 years of activity in the field of technological innovation and industrial automation for various industrial sectors, Gefran enters the sector of technologies for packaging, confirming its role as reference partner in digital transformation and the sustainability of processes. The company has already been collaborating with top companies in the sector, testing and refining innovative solutions that will lead to an important upgrade in the field of the power control of solid-state relay units.
«Our offer relates to the introduction of IO-link connectivity in the GRP series silicon-controlled rectifiers (SCR), with a view, above all, to greater flexibility in the mould-change phase » explains Paolo Colosio, Gefran’s sensors and components business developer. «While before the operator had to manually change the adjustable setpoints of the resistors, now, with IO-link, the silicon-controlled rectifier communicates directly with the PLC or with the controller, creating ad hoc recipes to send automatically to the SCR».
The solution lies in managing current loads and operating voltages that tend to be very low (200 -500 watt), precisely those required in the production of packaging.
Gefran also offers all the sensors on the machine (control of the feeder, stick-pack and label printing), as well as the entire area regarding temperature control.
