Components and other equipment

  • Barrier photocell for detection of liquids

    A supplier of high tech sensors for industrial automation in the packaging sector, Leuze electronic offers a number of specific solutions for bottling lines. After the GSU 14D and PRK 18B models, for recognition of transparent labels and bottles, respectively, the concern presents LS55 H20, a new barrier photocell with a stainless steel housing that enables detecting liquids, including…
  • Automate logistic processes

    Created to allow couriers, postal operators and logistics centers to identify the objects to be handled, registering their weight and volume, and all the information needed for shipping, DWS (Dimensioning, Weighing, Scanning) by SICK is the only certified system for tax purposes.
  • “Robatech and gluing”: topic developed with coherence

    Davide Morten, head of Robatech Italia, illustrates the leitmotifs of Swiss multinational’s participation at interpack, which it considers the ideal venue for offering recent technologies and new ideas that make gluing a means for achieving safety, efficiency and productivity.
  • Cabling and connection: Maximum food safety

    A Lapp Group subsidiary, leader in the development and production of integrated solutions in cabling and connection technology, Lapp Italia will be taking part at  SPS IPC Drives Italia 2017 (Stand 5 Pad. C012) with a proposal ranging in different application areas: From robotics to the railway sector, to  solutions for  food & beverage.
  • Precise adhesive tracking

    The Sapphire XP applicator head, the EcoBead Inspect application pattern generator and the ATS (Adhesive Tracking System): the latest Nordson Corporation developments featured at interpack.
  • High performance packaging components

    A company specializing in the design and manufacture of components for industrial machines and equipment for many industrial sectors, Elesa presented at interpack a wide range of packaging solutions specific to the packaging sector, which, in terms of turnover and volumes, is one of its main markets.
  • Continuous longitudinal ultrasonic seals

    Compact, easy to integrate and washable according to IP 65: Herrmann Ultraschall has completely reworked its module LSM Fin for continual longitudinal seals and chained bags on VFFS and HFFS.
  • Vacuum technology for the “smart” factory

    The Schmalz SCPS/SCPSi compact ejectors, with efficiency levels optimized by the Eco nozzle system, ensure a safe and high performance handling by intelligently managing energy consumption to the benefit of savings and sustainability.
  • Smarter, more compact vision technology

    The opportunities offered by the Italian government’s Industry 4.0 plan and the smart manufacturing solutions to enhance the flexibility and efficiency of the market at the focus of Datalogic’s stand at SPS IPC Drives.
  • Intelligent systems for glue application

    Optimized material consumption and increasing energy efficiency: these the benefits offered by Nordson’s solutions for the packaging industry, ideal for both large and for medium-low production needs. Focus on ATS (Adhesive Tracking System) and on the Starter Kit.
  • Nozzle system: efficient vacuum generation

    Already available for some years now in Schmalz’s portfolio of vacuum solutions, the compact SCPS/SCPSi series of ejectors with the new Eco nozzle system are ideal for highly dynamic handling processes.
  • ULTRAPACK AMG: new at interpack

    At Duesseldorf, Herrmann Ultraschall will focus on the new generator ULTRAPACK AMG, especially suitable for fast-running, multi-lane packaging machines. Due to its slim shape, it can be installed in a row, one next to the other, in 300-mm-deep standard electric cabinets.
  • Ultrasonic sealing: special for Italy

    The newly-opened Tech-Center in Modena is a central part of Herrmann Ultraschall’s strategy of cooperating with the major machine builders and end customers in the North Italian market. The company can look back on 20 years of experience in sealing with ultrasonics. The main focuses of the new product portfolio for 2017 are robust modules, simple integration and a generator with new interfaces.

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